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Starting from the bottom, multiple Chinese SiC large-size substrates with 8-inch production capacity
Release time:2025.11.27 Number of views:49

Domestic 8-inch SiC substrate enterprises have formed a clear production capacity echelon of "leading at the head, following at the waist, and catching up at the tail".
The first tier is represented by Tianyue Advanced, Tianke Heda, and Sanan Optoelectronics, which have large-scale production capabilities with a production capacity of over 100000 pieces per year. Their products have been verified by international mainstream customers and occupy a major market share. Among them, Tianyue Advanced's substrate production capacity, mainly 8-inch, will reach 460000 pieces/year by 2024, and the target total production capacity will be increased to 600000 pieces/year by 2025. The Shanghai Lingang factory has already achieved an annual production capacity of 300000 conductive substrates in mid-2024, and is currently promoting the second phase of capacity improvement. Jinan, Jining bases and Lingang bases will form a coordinated supply; Tianke Heda has achieved large-scale production of 8-inch substrates by 2024, with a planned total substrate production capacity of 500000 to 800000 pieces (including 8 inches) and an epitaxial wafer production capacity of 250000 pieces by 2025. The Beijing and Xuzhou bases are the core, and the Shenzhen joint venture company has invested in Tianke to further strengthen the 6-8 inch substrate and epitaxial production capacity. The 8-inch products have been verified by mainstream device manufacturers at home and abroad and have obtained long-term LTA production orders; In the first half of 2025, the production capacity of 8-inch substrates at San'an Optoelectronics Hunan Base will reach 1000 pieces/month, and the epitaxial production capacity will be 2000 pieces/month. The Chongqing Base will establish a joint venture with STMicroelectronics, with a planned 8-inch substrate production capacity of 480000 pieces/year. The production line will be completed and samples will be delivered for verification in February 2025.
The second tier enterprises, represented by Shuoke Crystal, Nansha Wafer, and Jingsheng Electromechanical (subsidiary Zhejiang Jingrui), have achieved small-scale or large-scale production with a production capacity of 50000 to 100000 pieces per year. After the second phase of the Shuoke Crystal project is put into operation in October 2024, an additional 200000 pieces of 6-8 inch substrates will be added per year, and the total production capacity of 4-8 inches will jump to the top three in the world, with the Taiyuan base as the core production base; The 8-inch project of Nansha Wafer will be officially put into operation in Jinan North Base in 2024, with a production capacity of 50000 pieces per year. The plan is to increase the 8-inch production capacity to 500000 pieces per year by 2025, forming a layout in Guangzhou, Zhongshan, and Jinan; Jingsheng Electromechanical's 8-inch substrate production capacity will reach 3000 pieces/month (approximately 36000 pieces/year) by the end of 2024, and is planned to increase to 60000 pieces/year by 2025. The Ningxia Chuangsheng 8-inch substrate supporting project with an annual output of 600000 pieces will start construction in July 2025, and the first phase of the Penang base in Malaysia is also planned to have an 8-inch production capacity of 240000 pieces/year, with international and domestic production capacity coordinated.
Third tier enterprises such as Keyou Semiconductor and Tiancheng Semiconductor enter the stage of small-scale trial production or sample delivery after completing technical research and development, with a production capacity of less than 50000 pieces per year. By 2025, the 8-inch production capacity of Keyou Semiconductor will be 5000 pieces per year, and the second phase plan will expand to tens of thousands of pieces per year. In 2023, it has passed the stage acceptance of the "8-inch silicon carbide substrate material equipment development and industrialization process research" project and has the ability to produce in bulk; Tiancheng Semiconductor will achieve 8-inch mass production in the first quarter of 2025, with a planned production capacity of 50000 pieces per year (including 6/8 inches) in the first phase. The Taiyuan base will independently develop 8-inch processing technology, and the product quality will reach the leading level in China.