Beijing Yizhuang will spend another 10 billion!
According to official sources from Beijing Yizhuang, a government investment guidance fund with a scale of 10 billion yuan will be established in Yizhuang, Beijing, to continue focusing on enterprises that meet local industrial positioning and policies, such as the four leading industries and six future industries. Focus on various projects such as upgrading the industrial chain, strengthening and supplementing the chain, and independent innovation to provide impetus and support for building a modern industrial system.
It is reported that the second phase of the fund will establish three funds: the Industrial Upgrading Fund, the Industrial Special Fund, and the Mergers and Acquisitions Fund, to provide greater support for the Economic Development Zone to accelerate the development of new quality productivity.
Public information shows that the fund can be traced back to January 2023, when the first phase of the Economic Development Zone Government Investment Guidance Fund (hereinafter referred to as the "Phase I Fund") was registered and established, with a scale of 10 billion yuan. As of now, the first phase of the fund has decided on a total investment project amount of 8.403 billion yuan, with a reserve project investment amount of 4.413 billion yuan, which will drive social investment and reinvestment amounts exceeding 10 billion yuan Click to view the details of 'Beijing Yizhuang, spend another 10 billion!'
Strengthening cooperation between domestic and foreign semiconductor manufacturers
According to the latest research by TrendForce Consulting, in response to changes in the international situation, China's huge market has driven the formation of the China for China supply chain, and the situation in the automotive industry is particularly evident. Due to China's encouragement for domestic car companies to increase the proportion of domestically produced chips to 25% by 2025, as well as support for localized production by foreign companies, major automotive chip suppliers such as STMicroelectronics, Infineon, NXP, and Renesas have actively negotiated cooperation with Chinese wafer fabs such as SMIC and HHGrace in recent years, which will help accelerate the development of diversified platforms for Chinese wafer fabs.
In the past, due to the slow development of eFlash/eNVM processes in mid tier wafer fabs and the lengthy process of vehicle specification and validation for automotive products, it was difficult for mid tier wafer fabs to obtain outsourcing orders for IDM automotive MCUs. In recent years, Chinese car manufacturers not only need to consider the international situation and meet the requirements of localized production, but also need to actively seek effective cost reduction options for automotive suppliers due to the successive launch of affordable car models. Therefore, the China for China strategy and cost considerations have driven a positive attitude towards cooperation between European and Japanese IDMs and Chinese wafer fabs Click to view details on "The cooperation between European and Japanese IDMs and Chinese wafer fabs turns positive, seizing market opportunities"
National Large Fund Investment
Recently, the domestic integrated circuit industry has once again ushered in a shining moment. Big Fund III made a heavy investment, investing in two funds within one day (December 31, 2024) with a total investment of over 160 billion yuan, which can be described as a "generous" move.
It is reported that the two funds invested in by Big Fund Phase III are Huaxin Dingxin (Beijing) Equity Investment Fund (Limited Partnership) (hereinafter referred to as "Huaxin Dingxin") and Guotou Jixin (Beijing) Equity Investment Fund (Limited Partnership) (hereinafter referred to as "Guotou Jixin").
Among them, Huaxin Dingxin has a registered capital of up to 93.093 billion yuan, of which 93 billion yuan was contributed by the National Big Fund Phase III, accounting for 99.9001%. Huaxin Investment, as the executive partner, contributed 93 million yuan, accounting for 0.0999%. Its business scope includes engaging in equity investment, investment management, asset management and other activities through private equity funds Click to view the details of "National Team's' Generous' Actions, China's Integrated Circuit Welcomes High Light Moment Again"
In addition, recently, the National Integrated Circuit Industry Investment Fund Phase II Co., Ltd. (hereinafter referred to as "Big Fund Phase II") once again made an investment in a semiconductor equipment manufacturer, Nanjing Zhong'an Semiconductor Equipment Co., Ltd. According to shareholder disclosure information, the subscribed capital of the second phase of the large fund to Zhong'an Semiconductor is 2.0175 million yuan, with a shareholding ratio of 3.50508% Click to view the details of 'Big Fund Phase II makes another investment in semiconductor equipment manufacturers'
The storage market faces three major challenges
In the just passed year of 2024, the storage market staged a "song of ice and fire": the consumer electronics recovery in the terminal market was slow, while AI applications continued to make strong breakthroughs. Storage products have thus opened up a polarized development: consumer storage demand is flat, while the market for high-performance, enterprise level storage products is booming.
However, the trend of contract prices in the memory market is not so smooth sailing. Overall, in the first half of 2024, the contract prices in the memory market continued to rise. However, in the second half of the year, due to changes in market demand, the contract prices in the memory market encountered downward pressure. In the fourth quarter, DRAM showed a convergence of its gains, while NAND Flash reversed its decline.
Looking ahead to 2025, the industry believes that although AI applications are still very strong, driving up demand for high-performance HBM and QLC SSD products, there is still no strong recovery signal in the consumer electronics market, and the storage market may still face challenges in three aspects: terminal demand, price, and production capacity Click to view the details of 'The Storage Market Meets Three Major Challenges!'
EDA vendor completes nearly one billion yuan financing
Recently, domestic EDA enterprise Hejian Gongsoft completed nearly one billion yuan in Series A financing. According to one of the investors, "Pudong Venture Capital", this investment aims to support the growth and strengthening of domestic EDA leading enterprises.
According to data, Hejian Industrial Software was founded in 2020 and is an independent and innovative provider of high-performance industrial software and solutions. It mainly engages in the research and development of domestic high-performance industrial software and solutions, with EDA as its first breakthrough direction.
In the past few years, the Chinese EDA market has shown explosive growth. As an important part of the global EDA market, the EDA market size in China is expected to reach 12 billion yuan in 2023, accounting for approximately 10% of the global market. The China Semiconductor Industry Association once predicted that the EDA market size in China will reach 18.49 billion yuan by 2025, accounting for 18.1% of the global market Click to view details on 'Domestic EDA Manufacturers Complete Nearly One Billion Yuan Financing'
Three mergers and acquisitions in A-shares have been announced
Despite approaching the end of the year, the semiconductor capital market remains hot, and corporate mergers and acquisitions continue to occur frequently. Recently, three A-share listed companies have disclosed the news of semiconductor asset acquisitions.
Recently, well-known home appliance manufacturer Konka Group announced that it plans to issue shares to purchase a controlling stake in Hongjing Microelectronics and raise matching funds.
On January 7th, Guangdong NARI Radar, a listed company on the Science and Technology Innovation Board, announced that the company is planning to purchase 100% equity of Tianjin Sigma by issuing shares and paying cash.
Recently, Huawei Design, a A-share company on the Beijing Stock Exchange, issued two consecutive announcements indicating that the company intends to enter the integrated circuit field across borders. The main themes of the two announcements are respectively to launch new business and purchase assets. According to the announcement, in order to further expand its business segments and improve its operating conditions, Huawei Design plans to purchase 51% equity of Jiujiang Zhengqi held by natural person Liao Hongwei for 63 million yuan