According to the bidding documents, Beijing BOE Sensing Technology, a subsidiary of BOE, will construct the "Glass based Packaging Substrate R&D Test Line Project" in the Beijing Economic and Technological Development Zone. This project will purchase glass based process equipment, exposure equipment, etc., establish a research and industrialization test line for packaging process technology based on glass substrates, verify and industrialize the process technology of glass based integrated circuit (IC) packaging substrates, improve chip performance, and achieve large-scale packaging.

In terms of equipment supplier selection, BOE has chosen Onto Innovation from the United States to provide AOI equipment, while domestic suppliers have been selected for slag removal equipment, chemical copper plating equipment, and adhesion promoter equipment. This indicates that BOE is utilizing both international and domestic resources to advance the project.

Semiconductor glass substrates, as the next generation technology, have attracted much attention. Their surfaces are smoother and thinner than existing substrates, allowing for finer circuits and less warping caused by heat. They are particularly suitable for high-performance, high-density semiconductors with high heat generation. However, due to the characteristics of glass materials, development work faces significant challenges, and currently no company has commercialized semiconductor glass substrates.

Industry insiders analyze that BOE, as a leading enterprise in the display field, has rich accumulation of glass substrate technology and a complete supply chain, which gives it certain advantages in the field of semiconductor glass substrates. This entry into the semiconductor glass substrate business is seen as an important strategic measure for BOE to expand into the semiconductor field by utilizing its accumulated technology in the display industry.

It is reported that news of BOE's involvement in semiconductor glass substrate business has been circulating since the second half of last year, and this equipment procurement indicates that the company has entered the substantive stage of project promotion.