1、 Collaboration Highlights: From devices to systems, silicon carbide is fully integrated into the electric drive mainline. According to the agreement, Ansenmei will provide customized power devices for Schaeffler traction inverters on its vertically integrated EliteSiC product platform. Its core advantages include: reducing conduction loss by 20%; compared to traditional devices, it has better energy efficiency performance under typical operating conditions; Strong short-circuit robustness: enhanced thermal stability and switch control characteristics improve system reliability; Improving system efficiency by 3-5%: This translates to a 10% increase in overall vehicle range, which is crucial for PHEVs; Device level vehicle certification+system level collaborative design: Accelerate the import cycle and reduce integration risks. Of particular note is that this batch of inverter products will be applied to the new generation high-end PHEV platform of a global mainstream car company, and its models are likely to target the mainstream mid to high end consumer markets in Europe, America, and East Asia. This means that the unit price and added value of SiC devices will also be much higher than traditional A-class pure electric platforms. 2、 Evolution of industrial pattern: SiC enters a new stage of "Tier-1 × IDMs" joint promotion. This cooperation shows a clear trend: the SiC industry is accelerating from single point technological breakthroughs to upstream and downstream integration. As a representative of IDM mode, Ansenmei has the full process manufacturing capability from SiC substrate → epitaxy → chip → module packaging; Schaeffler has unique advantages in powertrain system level design and binding with OEM customers. The combination of the two directly connects the value chain from components to the main drive system, and then to the OEM vehicle platform. In this context, the global SiC landscape is evolving into: cooperation types represent combination advantages, IDM x Tier-1 collaborative development, Anson Mei x Schaeffler

STMicroelectronics x ZF's closed-loop collaboration from materials to systems, fast optimization iteration, strong customer stickiness IDM x OEM targeted cooperation Infineon x BYD

Wolfspeed x Tesla (history) rapid verification, customer exclusive device development, strong brand binding effect, Foundry+Fabless model. Typical domestic enterprises (such as Huarun Micro and Silan Micro) flexibly accept orders, suitable for medium and low voltage and general markets, but with high technical barriers. Summary: The competition in the silicon carbide industry will eventually fall on "system solution" and "customer power". From the cooperation between Anson Mei and Schaeffler, it can be seen that the silicon carbide industry is entering a triple competition stage of "system solution capability+global customer binding+technical depth": whoever masters the system level energy efficiency optimization tool chain can make truly competitive products in the market; Whoever can bind more host factories and Tier-1 customers will be closer to the terminal profit pool; Who owns the pace of the evolution of substrate chip packaging full chain technology, and who can reduce costs to seize penetration. In the accelerated expansion cycle of SiC applications in the future, this deep integration mode of "IDM × Tier-1" will be one of the important directions for industry evolution.