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Tianke Heda's delivery volume of silicon carbide substrates has exceeded one million pieces
Release time:2025.08.08 Number of views:41

1、 Deep cultivation for 20 years: Connecting the entire chain from equipment to materials

The milestone breakthrough of Tianke Heda is attributed to the company's nearly 20 years of technological accumulation and integrated strategic layout. Unlike many substrate companies that only focus on the "cutting, grinding, and polishing" processing steps, Tianke Heda has established a core competency system for the entire process, including single crystal growth equipment development, crystal growth, chip processing, and epitaxial growth. It has achieved a closed-loop system of process research, equipment manufacturing, and mass production.

  

At the crystal growth end, the company adopts advanced technologies such as Laser Assisted Substrate Reuse to significantly improve ingot utilization and effectively reduce material costs. This not only enhances the profitability of enterprises, but also allows downstream users to enjoy cost-effectiveness advantages, helping accelerate the transition of silicon carbide devices from "high-end monopoly" to "scale popularization".

2、 The 8-inch product has made a comprehensive breakthrough and won global validation

Faced with the trend of upgrading the silicon carbide industry from 6 inches to 8 inches, Tianke Heda launched research and development on the 8-inch platform as early as 2020 and was the first to achieve mass production capability. Compared to 6-inch chips, 8-inch products have nearly 90% area gain and significant advantages in unit cost, production line efficiency, and downstream packaging compatibility.

At present, Tianke Heda's 8-inch conductive silicon carbide substrate has been verified by major global device manufacturers such as Infineon and Xinlian Integration, and has obtained long-term supply orders. The core technical indicators have reached or exceeded the international advanced level, laying a technological first mover advantage for domestic manufacturers to compete for the next generation power semiconductor market.

3、 Targeting a new track: AR optical waveguide and advanced packaging are advancing synchronously

In addition to consolidating the main battlefield of automobiles and optical storage, Tianke Heda is also actively expanding emerging applications. In response to the optical pain points in the AR glasses market, the company has launched a specialized 8-inch optical waveguide silicon carbide substrate, which utilizes its high refractive index and high thermal conductivity material characteristics to effectively solve technical bottlenecks such as narrow field of view, "rainbow stripe" interference, and thermal accumulation.

To accelerate commercialization, the company has established a joint venture with leading enterprise in the AR optical waveguide field, Mude Micro Nano, to jointly promote the productization and industrialization process of the substrate+diffractive optical waveguide technology platform.

At the same time, the company has also launched the research and development of 12 inch conductive and heat sink SiC substrates, entering the field of advanced third-generation semiconductor packaging materials, further expanding the technological boundaries and application space.

4、 Serving over 500 clients and building a global market foundation

As of now, Tianke Heda has served more than 500 customers worldwide, and its products are widely used in multiple main models of domestic and foreign car companies such as BYD. It has also established stable cooperation with several international leading energy storage companies, demonstrating that its products have gained mainstream market recognition in terms of reliability, consistency, and mass production capabilities.

Relying on the integration strategy of "substrate+epitaxy" and multidimensional product matrix, Tianke Heda is accelerating the construction of a silicon carbide industry ecosystem covering automotive grade devices, optical storage fusion, AR optics, advanced packaging and other scenarios.