The global semiconductor market is booming, and 8-inch SiC has become a new development opportunity. On November 20th, according to the Science and Technology Innovation Board Daily, Wang Ruoda, senior expert of the China Semiconductor Industry Association, stated at the 2024 China International Semiconductor Expo that the global semiconductor market has grown nearly 20 times in the past 35 years, with an average annual growth rate of 9%. He predicts that by 2030, the global semiconductor market is expected to grow to $1 trillion, with an average annual compound growth rate of 8%. In the field of silicon carbide, according to Zhao Zhengping, former deputy general manager of China Electronics Technology Group, the wide bandgap semiconductor SiC has entered a turning point in development, and 8-inch SiC has become a new development opportunity. SiC MOSFETs are expected to dominate the market in the next decade and gradually reduce manufacturing costs in their adaptation areas. Recently, local silicon carbide substrate company Tianyue Advanced (58.640, -0.41, -0.69%) launched its first 12 inch (300mm) silicon carbide substrate product at the Munich Semiconductor Exhibition in Germany. In addition, the company has already introduced cutting-edge SiC substrate technologies such as P-type substrates and liquid-phase preparation, and is expected to continue leading the industry trend in the SiC substrate field.    The global storage market is steadily growing, and Samsung is expanding its investment in production bases both domestically and internationally. On November 18th, according to the Science and Technology Innovation Board Daily, citing news from the flash memory market, the global storage market continued its growth trend in the third quarter of 2024, with the server market continuing to drive storage demand growth. The global storage market reached $44.871 billion in the third quarter of 2024, with a QoQ of+8.3%. In terms of classification, according to CFM flash memory market data, the global NAND flash market size increased by 5.7% month on month to $19.021 billion in Q3 2024, and the DRAM market size increased by 10.4% month on month to $25.85 billion. By the first three quarters of 2024, the global storage market has accumulated a size of $120.225 billion, with Yoy+96.8%. Against the backdrop of increasing demand for AI chips, the importance of packaging in HBM products is also constantly strengthening. Currently, Samsung Electronics is expanding its investment in domestic and overseas production bases to enhance its semiconductor advanced packaging business. According to BusinessKorea, cited by the Science and Technology Innovation Board Daily, Samsung recently signed a contract for the sale and purchase of semiconductor equipment in the third quarter to expand its production facilities at its Suzhou factory in China. The contract is worth approximately 20 billion Korean won. The Suzhou factory is currently Samsung Electronics' only overseas testing and packaging production base. In addition, Samsung has recently signed investment agreements with Chungcheongnam do and Cheonan City in South Korea to expand its semiconductor packaging process facilities