2025-11-10
Will silicon carbide (SiC) become the "savior of heat dissipation" for AI chips? NVIDIA and TSMC hav
In recent years, the demand for artificial intelligence computing power has exploded, chip power consumption continues to rise, and heat dissipation has become the "number one challenge" restricting the development of AI. Just recently, there was a heavyweight news in the industry that Nvidia is planning to use a 12 inch silicon carbide (SiC) substrate as an advanced packaging intermediate layer (Interposer) in the new generation of GPUs, expected to be introduced no later than 2027. Does this trend mean that SiC is about to trigger a revolution in chip materials?