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Semiconductor giants wait and see, TSMC slows down CoWoS packaging capacity expansion in 2026!
Release time:2024.11.22 Number of views:61

    Faced with the booming AI market, TSMC is actively expanding its advanced packaging CoWoS production capacity. From 2024 to 2025, the production capacity target will double, but it is still difficult to meet market demand.

    TSMC Radio South New Plant (AP8) is expected to be completed in March April next year and put into operation in the second half of the year; And plan to acquire the second old factory of Qunchuang to further enhance production capacity.

    The Chiayi plant (AP7) will also be delivered by the end of 2025, with equipment installed in the first half of 2026, mainly for expanding SoIC production capacity, and is expected to start production by the end of the year.

    However, the expansion plan originally scheduled to last until 2026 has encountered variables. Some equipment suppliers have revealed that TSMC has delayed the procurement of some equipment and postponed the installation plan for equipment in 2026.

    According to industry sources, in addition to political factors, TSMC's expansion plan adjustment is also affected by other factors, such as a delay of 2-3 months in the delivery of equipment for the old AU Optronics factory and a deadlock in negotiations to acquire the second factory.

    Multiple equipment suppliers have received notices from TSMC requesting a temporary suspension of their cooperation plans for 2026. This indicates that TSMC is reassessing market risks and adjusting its future investment strategies.